Event: Ic Packaging Technology Expo Icp
Event from: 20th-24th Jan, 2010
Venue: Tokyo International Exhibition Center, Japan

Contact

Reed Exhibitions Japan Limited
18f Shinjuku - Nomura Building,
1-26-2 Nishishinju,
Tokyo - Japan
Tel: + 81-3-33498501
Fax: + 81-3-33498599





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