Event: IC Packaging Technology Expo
Event from: 19th-21st Jan 2011
Venue: Tokyo International Exhibition Center, Japan

Contact

Reed Exhibitions Japan Ltd.
18F Shinjuku - Nomura Building,
1-26-2 Nishishinjuku, Shinjuku -,
Tokyo, Japan
Tel: +(81)-(3)-33498501
Fax: +(81)-(3)-33498599





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